Principal Systems Engineer, MEMS Package Development

Engineering – Engineering                ·                  Alameda, CA              ·            Full time

Principal Systems Engineer, MEMS Package Development

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• 1020 Atlantic Avenue, Suite 100 Alameda, CA 94501
• Engineering – Engineering
• Hybrid

iota Biosciences, a wholly-owned subsidiary of Astellas Pharma US, is a medical device company pioneering bioelectronic solutions across a range of medical therapies and diagnostics. Bioelectronic medical implants are the start of an entirely new form of medicine, treating chronic diseases through non-pharmaceutical mechanisms not previously accessible to clinicians.

iota Biosciences, Inc. was acquired by Astellas Pharma US in November 2020. Astellas Pharma US, Inc. is an affiliate of Tokyo-based Astellas Pharma Inc., a top 20 global pharmaceutical research company. Astellas is committed to turning innovative science into medical solutions that bring value and hope to patients and their families. iota’s core proprietary technology stack leverages ultrasonic energy to communicate with and power custom implantable devices, enabling completely new clinical approaches to treating diseases. At iota Biosciences you will be given the opportunity to substantially influence the design and success of these pioneering Class III medical implants, as the company expands the reach of its novel technology while bringing new solutions to the clinic.

Responsibilities:

• Package Design and Development:
  • Design and develop packaging solutions for MEMS-based sensors and Ultrasound Transducers, considering factors such as size, cost, performance, and reliability.
  • Utilize CAD software and simulation tools to create 3D models and perform thermal, mechanical, and electrical simulations of sensor and Transducers packages.
• Material Selection and Characterization:
  • Select appropriate materials for sensor packaging, considering compatibility with MEMS devices and environmental conditions.
  • Characterize material properties relevant to packaging, such as thermal conductivity, coefficient of thermal expansion, and moisture resistance, sensor drift.
• Process Development and Optimization:
  • Collaborate with process engineers to develop and optimize packaging processes, including die attach, wire bonding, encapsulation, and sealing.
  • Conduct experiments and process simulations to improve yield, reliability, and cost-effectiveness of sensor and transducers packaging.
• Reliability and Failure Analysis:
  • Perform reliability testing on sensor packages to assess long-term performance and durability under various operating conditions.
  • Conduct failure analysis to identify root causes of package failures and implement corrective actions.
• Quality Assurance and Manufacturing Support:
  • Establish quality control procedures for sensor packaging, including inspection criteria and testing protocols.
  • Provide technical support to manufacturing teams to ensure consistent and reliable production of sensor packages.
• Documentation and Reporting:
  • Create detailed design documentation, including package drawings, specifications, and test reports.
  • Prepare technical reports and presentations to communicate packaging designs and findings to cross-functional teams and customers.
• Collaboration and Cross-functional Communication:
  • Work closely with design engineers, MEMS process engineers, and product managers to ensure alignment of packaging requirements with overall product goals and specifications.
• Research and Innovation:
  • Stay updated with the latest advancements in sensor packaging technology and materials.
  • Identify opportunities for innovation and contribute to the development of new packaging solutions and intellectual property.

Qualifications:

• Ph.D. degree in Mechanical Engineering, Electrical Engineering, Materials Science, or a related field.
• 3+ of experience in sensor packaging, preferably with MEMS devices.
• Proficiency in CAD software (e.g., SolidWorks, AutoCAD) and simulation tools (e.g., ANSYS, COMSOL).
• Strong understanding of packaging materials, processes, and reliability testing methodologies.
• Experience with failure analysis techniques and quality assurance practices.
• Excellent problem-solving and analytical skills.
• Effective communication and collaboration abilities.

Preferred Qualifications:

• Previous experience in packaging class-3 implantable devices
• Familiarity with manufacturing processes and cleanroom environments.
• Track record of successful MEMS packaging projects.

Salary Range : 180000 – 230000 USD / year

At iota Biosciences, we take pride in providing equal employment opportunities to everyone, inclusive of race, ethnicity, beliefs, religion, marital status, gender, gender identity, citizenship status, age, veteran status or disability.

iota offers a very competitive benefits package that includes the following:

Health

• Employees thrive when healthy, both physically and mentally:
• Comprehensive health coverage for you and your family, covered at 100%
• Employee Assistance Program

Time-off

• Take time off when you need to take it:
• Generous PTO policy
• Paid parental leave
• Paid holidays beyond the traditional
• Paid volunteer day

Competitive Compensation

• In addition to our competitive base salaries, we offer:
• Annual Bonus Plan
• Long Term Incentive Plan (LTIP)
• 401k plan with matching contributions equal to 100% of your deferral contributions up to 5% of your eligible compensation

Please click here to apply.